![]() In this sense, precision grinding and polishing processes are primarily used to generate high-quality and functional components usually made of hard and brittle materials. Furthermore, high-energy processes with UV lasers and IR lasers, and ultrasonic vibration can be used to assist abrasive technologies for greater precision and efficiency. The machining of high-precision components and their molds/dies by abrasive processes is much more difficult owing to their complex and nondeterministic nature as well as their complex textured surface. However, hard and brittle ceramics, hardened steel for molds, or semiconductor materials have to be machined by precision abrasive technologies such as grinding, polishing, and ultrasonic vibration technologies with diamond super abrasives. Certain types of hard metals can be machined by deterministic precision-cutting processes. The demand for high-precision and high-efficiency machining of hard ceramics such as silicon carbide (SiC) for semiconductors and hardened steel for molding dies has significantly increased for power devices in automobiles, optical devices, and medical devices.
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